產(chǎn)品與市場(chǎng)
SI10US
特點(diǎn)
● 低CTE,高模量,可有效降低封裝基板的翹曲● 優(yōu)異的耐濕熱性
● 良好的PCB加工性
● 無鹵材料
應(yīng)用領(lǐng)域
- eMMC, DRAM
- AP, PA
- Dual CM
- Fingerprint, RF Module
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
Items | Condition | Unit | SI10US |
---|---|---|---|
Tg | DMA | ℃ | 280 |
Td | 5% wt. loss |
℃ |
>400 |
CTE (X/Y-axis) | Before Tg |
ppm/℃ |
10 |
CTE (Z-axis) |
α1/α2 |
ppm/℃ |
25/135 |
Dielectric Constant 1) (1GHz) | 2.5.5.9 | - | 4.4 |
Dissipation Factor 1) (1GHz) |
2.5.5.9 | - | 0.007 |
Peel Strength1) | 1/3 OZ, VLP Cu |
N/mm |
0.80 |
Solder Dipping | @288℃ | min | >30 |
Young's modulus | 50℃ | GPa | 26 |
Young's modulus |
200℃ |
GPa |
23 |
Flexural Modulus1) |
50℃ |
GPa |
32 |
Flexural Modulus1) |
200℃ |
GPa |
27 |
Water Absorption1) |
A | % | 0.14 |
Water Absorption1) | 85℃/85%RH,168Hr |
% |
0.35 |
Flammability |
UL-94 |
Rating |
V-0 |
Thermal Conductivity | - | W/(m.K) | 0.61 |
Color | - | - | Black |
Remarks:
*Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.
*1): specimen thickness: 0.80mm.
All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.