S1170G
特點
● 耐CAF
● 無鉛兼容
● 優(yōu)異的通孔可靠性
● 不含鹵素、銻、紅磷等成分
應用領域
● 消費電子
● 智能手機
● 汽車電子
● 電腦
● 儀器儀表
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 180 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 390 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 5.65 x 107 | |
| E-24/125 | MΩ.cm | 2.71 x 107 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.99 x 106 | |
| E-24/125 | MΩ | 4.44 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 180 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
|
Dissipation Constant (Dk) RC52% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.4 | |
| Dissipation Factor (Df) RC52% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.010 | |
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.3 | |||
| 125℃ | N/mm | 1.1 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.
2. All the typical value is based on the 1.6mm(8*7628) specimen.
3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.