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S7439G
特點
● 高 Tg: 189℃(DMA), 181℃ (DSC)
● 低 Dk/Df (@10GHz, IPC-TM-650 2.5.5.5): 3.74/0.0060
● 較低的Z軸CTE
應(yīng)用領(lǐng)域
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- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 181 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
189 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 405 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 225 | |||
| 50-260℃ | % | 2.5 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
s | 100 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.93 | |
|
IPC-TM-6502.5.5.5 |
10GHz |
-- |
3.74 |
||
|
IEC 61189-2-721 |
10GHz | -- | 4.08 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0045 | |
|
IPC-TM-6502.5.5.5 |
10GHz |
-- | 0.0060 | ||
|
IEC 61189-2-721 |
10GHz | -- | 0.0070 | ||
|
Volume Resistivity |
2.5.17.1 |
C-96/35/90 |
MΩ.cm |
9.0×108 |
|
| Surface Resistivity |
2.5.17.1 |
C-96/35/90 |
MΩ |
2.0×107 |
|
|
Dielectric Breakdown |
2.5.6 |
D-48/50+D-0.5/23 |
kV |
＞45 |
|
|
Peel Strength (1oz copper foil) |
2.4.8 |
After thermal Stress 288℃,10s |
N/mm [lb/in] | 1.2 [7.0] | |
| Water Absorption |
2.6.2.1 |
E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 |
C-48/23/50 |
Rating | V-0 | |
Remarks:
1. All the typical value is based on the 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.