產(chǎn)品與市場(chǎng)
Synamic 6GX
特點(diǎn)
● 低Dk/Df@10GHz:3.73/0.005● 更優(yōu)異的耐熱性，Td＞400℃，T300＞60min
● 更低的Z軸熱膨脹系數(shù)，優(yōu)異的通孔可靠性
● 更低的吸水率，優(yōu)異的耐濕耐熱性
● 無鉛制程兼容
應(yīng)用領(lǐng)域
● 超高速網(wǎng)絡(luò)設(shè)備
● 服務(wù)器、交換機(jī)、存儲(chǔ)、路由器、基站BBU等
● 高性能計(jì)算機(jī)
● 光通信產(chǎn)品
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25D | DSC | ℃ | 172 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 405 |
|
T288 |
2.4.24.1 | TMA | min | >60 |
| T300 |
2.4.24.1 |
TMA |
min |
>60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
s | 100 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 31 |
| After Tg | ppm/℃ | 205 | ||
| 50-260℃ | % | 2.2 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.87 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.73 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0023 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0050 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.9 [5.14] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.
Remarks:
Remarks:
1.All the typical value is based on 6*2116 (0.76mm) thickness specimen,not guarantee data.
2.All thetypical value listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.