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Synamic8G
特點(diǎn)
● 低Dk/Df (10GHz): 3.66/0.0032
● 高Tg 200℃ (DMA)
● 更優(yōu)異的熱可靠性
● 更優(yōu)異的耐離子遷移性能
應(yīng)用領(lǐng)域
● 超高速網(wǎng)絡(luò)設(shè)備
● 服務(wù)器、交換機(jī)、存儲、路由器等
● 高性能計(jì)算機(jī)
● 高頻測量儀器等
● 光通信產(chǎn)品
- 產(chǎn)品性能
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- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 200 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 430 |
|
T288 |
2.4.24.1 | TMA | min | >120 |
| T300 |
2.4.24.1 |
TMA |
min |
>120 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 45 |
| After Tg | ppm/℃ | 230 | ||
| 50-260℃ | % | 2.2 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.62 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.66 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.98 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0015 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0032 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0040 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82 [4.7] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks :
1. All the typical value is based onthe 30mil (6*2116) thickness specimen, but not guarantee data.
2. All the typical value listed aboveis for your reference only, please turn to ShengyiTechnology Co., Ltd. for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.