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SML02G
特點
● 高Tg >170℃ (DSC),無鹵材料
●較低 X/Y軸 CTE (<13ppm),可提供優(yōu)異的通孔性能
● 較低的插損表現(xiàn),Dk/Df@10GHz:4.24/0.069
● 極好的耐離子遷移能力
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Items | Method | Condition | Unit | Typical Value | |
---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | |
|
|
DSC |
℃ |
175 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 420 | |
CTE (X/Y-axis) | IPC-TM-650 2.4.24.5 | 50-125℃ | ppm/℃ | 11-13 | |
CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
25 | |
After Tg | ppm/℃ | 125 | |||
50 |
% | 1.2 | |||
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | min | PASS | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 3.76 x 107 | |
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.16 x 107 | |
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 180 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 4.24 | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0053 | |
IPC-TM-650 2.5.5.5 |
10GHz |
-- |
0.0069 |
||
Peel Strength (1Oz) | IPC-TM-650 2.4.8 | After thermal Stress 288℃,10s | N/mm | 1.00 | |
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Remarks:
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.
2. The typical CTE value is based on specimen with 2116, whilethe Tg is for specimen≥0.50mm.
3. All the typical values listed aboveare for your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.