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SF315B
特點(diǎn)
● 粘結(jié)強(qiáng)度高、尺寸穩(wěn)定性好。
● 優(yōu)秀的耐熱性、耐化學(xué)性和電性能。
● 溢膠量低，加工性好，適于快速壓合和傳統(tǒng)壓合。
● 滿足RoHS指令要求，不含鉛、汞、鎘、六價(jià)鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等。
應(yīng)用領(lǐng)域
多層撓性印制板和剛撓性印制板等用粘接膜
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.0 |
| 288℃, 5s | 0.9 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 100 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
2.51×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.02×105 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.02 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/19 unsupported epoxy adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.