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SF206B
特點
● 低介電常數(shù)，低傳輸損耗 。
● 與銅箔和PI具有良好的粘結(jié)性。
● 不含鹵素，阻燃性達到 UL94 V-0 級。
● 優(yōu)秀的耐熱性、耐化學性和電性能。
● 加工性好，適用于傳統(tǒng)壓合工藝。
● 滿足 RoHS 指令要求，不含鉛、汞、鎘、六價鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等。
應用領(lǐng)域
高頻多層印制板和剛撓多層印制板等用粘接膜- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.1 |
| 288℃, 5s | 1.1 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
|
Electric Strength |
IPC-TM-650 2.5.6.2A |
D-48/50+D-0.5/23 |
KV/mm |
40.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
3.03×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.92×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 2.52 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.0026 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm |
＜0.15 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition.
1.Certified to IPC-4203/24 Unsupported polyimide adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.