BIF202
特點
● 優(yōu)秀的粘接性、耐熱性、尺寸穩(wěn)定性、耐彎曲性 和絕緣性能。
● 無鹵阻燃，達到UL94 VTM-0級。
● 溢膠量低，加工性好，適于快速壓合，傳統(tǒng)壓合，可返修，室溫存放。
● 滿足RoHS指令要求，不含鉛、汞、鎘、六價鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等環(huán)境管理物質。
應用領域
疊層母排用絕緣膠膜- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 2.2 |
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4c | E-0.5/150 | % | -0.4/-0.5 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 47 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 2.6×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 2.7×105 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.5 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.02 |
| Flammability | UL94 | E-24/125 | Rating | VTM-0 |
Remarks:
*Testing after laminating with treatment side of 35μm ED copper foil in suitable condition
All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.