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SDI06K
特點(diǎn)
● 無鉛兼容● 高Tg無鹵，Tg 220℃ (TMA)
● 較低的X/Y/Z軸CTE
● 低介質(zhì)常數(shù)及損耗
應(yīng)用領(lǐng)域
● 適用于智能手機(jī)，筆記本電腦，平板電腦，儀表盤，錄像機(jī)，電視，電子游戲機(jī)，通訊設(shè)備及汽車電子等- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 260 |
| 2.4.24 | TMA | 220 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 420 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 25-30 |
| 50-260℃ | % | 1.4 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50, RC50% | - | 4.0 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50, RC50% |
- | 0.0040 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.76×108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.84×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 181 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
A |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
GPa |
24/ 23 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: 1. All the typical value is based on the1.0mm specimen. (*) is based on 0.10mm(1x2116) specimen.
2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.