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>無鹵無鉛兼容FR-4.1, FR-15.1
S1150G
特點
● 不含鹵素、銻、紅磷等成分。廢棄燃燒時不產(chǎn)生劇毒其他和殘留有毒成分
● 優(yōu)良的機械加工性和耐熱性，與無鉛制程兼容
● 耐CAF
應用領域
● 智能手機、平板電腦、筆記本電腦
● LED, 游戲機
● 汽車電子
● 通訊設備
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 155 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 355 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
| After Tg | ppm/℃ | 230 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 1.15E+08 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 9.61E+06 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 178 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | -- | 4.5 | |
| Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | -- | 0.011 | |
| Peel Strength (1 oz) | IPC-TM-650 2.4.8 | 288℃,10s | N/mm[lb/in] | 1.5[8.57] | |
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 630 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 480 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.1 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| CTI | IEC 60112 | A | Grade | PLC 1* | |
Remarks:
1. Specification sheet: IPC-4101/128, is for your reference only.
2. All the typical value is based on the 1.6mm (8*7628) specimen.
3. * Thickness≥1.4mm with 7628can meet PLC 1. If you need to use a CCL of thickness <1.4mm or PP thinnerthan 7628 for application of high CTI requirements, please consult Shengyicustomer service engineer in advance.
4. All the typical valuelisted above is for your reference only, please turn to Shengyi Technology Co.,Ltd for detailed information, and all rights from this data sheet are reservedby Shengyi Technology Co., Ltd.