SP175M
Characteristic
● Lead free compatible● Excellent thermal reliability
● Low Z-axis CTE
● Low water absorption
Application Area
● Suitable for high aspect ratio and high-layer PCB.
● Widely used in computer, communication equipment, precise apparatus and instrument, router and etc.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.2 | DMA | ℃ | 175 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 348 |
|
T288 |
2.4.24.1 | TMA | min | 20 |
| T260 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.24.13 |
288℃, solder dip |
- | ＞60s No Delamination |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 56 |
| After Tg | ppm/℃ | 326 | ||
| 50-260℃ | % | 3.8 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - |
3.6 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.0164 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ/cm | 4.6 x 106 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 7.9 x 105 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 90 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 45+KV NB |
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.3 |
| Water Absorption | 2.6.2.1 | D-24/23 | % | 0.20 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| CTI | IEC60112 | A | Rating | PLC3 |
Remarks:
1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.
3. Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
No Record