Synamic 6N
Characteristic
● Tg 205℃ (DMA)● Low Dk/Df
● Td＞400℃, T300＞60min
● Low Z-axis CTE
● Low moisture absorption, excellent thermal reliability
● Lead-free compatible
Application Area
● ~56Gbps HSD networking equipment
● Server, Switch, Storage, Routers, Base station BBU...
● High performance super computer
● High frequency application
● Optical communication
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 205 |
| 2.4.25D |
DSC |
185 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 402 |
|
T288 |
2.4.24.1 | TMA | min | 120 |
| T300 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 50 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.0 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.41 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.35 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.52 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0013 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0021 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0026 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82 [4.68] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. All the typical value is based on the 0.76mm (6*2116) thickness specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.