Synamic 6GX
Characteristic
● LowDk/Df@10GHz: 3.73/0.005
● High heatresistance Td >400℃, T300 >60min
● Lower Z-axisCTE
● Lowermoisture absorption
Application Area
● High Speed Network equipment,
● Server, Switch, Storage and Routers,
● High Performance Computing,
● Optical Modulus, etc.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25D | DSC | ℃ | 172 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 405 |
|
T288 |
2.4.24.1 | TMA | min | >60 |
| T300 |
2.4.24.1 |
TMA |
min |
>60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
s | 100 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 31 |
| After Tg | ppm/℃ | 205 | ||
| 50-260℃ | % | 2.2 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.87 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.73 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0023 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0050 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.9 [5.14] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.
Remarks:
Remarks:
1.All the typical value is based on 6*2116 (0.76mm) thickness specimen,not guarantee data.
2.All thetypical value listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.