SF305R
Characteristic
●Halogen free and phosphorus free, UL94 V-0.
●High bonding strength, good dimensional stability
●Excellent soldering reliability, chemical resistance and electrical properties.
●Low adhesive flowing, good processability, suitable for both fast and traditional lamination style.
●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE, etc..
Application Area
Stiffener for FPC.
- Product Performance
- Product Certificate
- Data Download
|
Test Item |
Test Method |
Unit |
Standard Value |
Typical Value |
|
|
SF305R 5025 |
SF305R 8025 |
||||
|
Resin Flow |
Shengyi Method |
mm |
＜0.15 |
＜0.15 |
＜0.15 |
|
Peel Strength (90°) |
IPC-TM-650,No.2.4.9 Method A Method C |
N/mm |
≥0.7 ≥0.7 |
1.2 1.0 |
1.2 1.1 |
|
Thermal Stress |
IPC-TM-650,No.2.4.13 |
- |
Pass |
Pass |
Pass |
|
Dimensional Stability |
Shengyi Method |
% |
±0.1 |
±0.08 |
±0.08 |
|
Volume Resistivity |
IPC-TM-650,No.2.5.17 |
MΩ-cm |
≥106 |
2.0×106 |
2.5×106 |
|
Surface Resistance |
IPC-TM-650,No.2.5.17 |
MΩ |
≥104 |
1.5×105 |
1.5×105 |
Remarks:
Explanations: * Certified to IPC-4203/2 Epoxy adhesive on one or two sides of poyimide dielectric and Shengyi standard.