SDI03K
Characteristic
● Lead free compatible.
● High Tg halogen free, Tg 190℃ (DMA)
● UV Blocking/AOI compatible.
● Good dimensional stability.
Application Area
● Smartphone, NB, Tablet, SSD, DDR, Automotive electronics
● Instrument, VCR, TV
● Game Machine
● Communication equipment
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.2 | DMA | ℃ | 190 |
| 2.4.24 | TMA | 165 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 390 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 30 |
| After Tg | ppm/℃ | 190 | ||
| 50-260℃ | % | 2.1 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50, 1027RC75% | - | 3.38 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50, 1027RC75% |
- | 0.0072 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 3.87×109 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.72×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 182 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
288℃/10s |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
MPa |
510/490 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.06 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. Specification sheet: IPC-4101/130, is for your referenece only.2. All the typical values listed above are for your reference only, please contact Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.