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EN/CN

Product

Synamic 6GX

Characteristic

LowDk/Df@10GHz: 3.73/0.005

High heatresistance Td >400℃, T300 >60min

Lower Z-axisCTE

Lowermoisture absorption



Application Area

● High Speed Network equipment,


Server, Switch, Storage and Routers,

High Performance Computing,

Optical Modulus, etc.


  • Product Performance
  • Product Certificate
  • Data Download

Items Method Condition Unit Typical Value
Tg 2.4.25D DSC 172
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min >60
T300 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
s 100
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 31
After Tg ppm/℃ 205
50-260℃ % 2.2
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.87
2.5.5.5 (10GHz)
C-24/23/50
- 3.73
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0023
2.5.5.5 (10GHz)
C-24/23/50
- 0.0050
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.9 [5.14]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.08
Flammability
UL94
C-48/23/50
Rating
V-0

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.



Remarks:

Remarks:

1.All the typical value is based on 6*2116 (0.76mm) thickness specimen,not guarantee data.

2.All thetypical value listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.

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