Product
BIF201
Characteristic
● Excellent bonding strength,heat resistance, dimensional stability,bending performance and insulation performance.
● Halogen-free and flammabilityUL94 VTM-0.
● Low adhesive flowing, good processability,suitable forboth fast and traditional lamination style，can be repaired ,Storage at roomtemperature
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Insulation bonding sheet for laminated busbars.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.8 |
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4c | E-0.5/150 | % | -0.3/-0.45 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 47 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 8.4×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 1.5×106 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.5 |
| Dissipation Factor(10GHz) | SPDR | C-24/23/50 | - | 0.02 |
| Flammability | UL94 | E-24/125 | Rating | VTM-0 |
Remarks:
*Testingafter laminating with treatment side of 35μm ED copper foil in suitable condition.
All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.