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S1125
Characteristic
● Halogen free, dicy curedsystems,normal Tg;
● Free of constituents suchas antimony,red phosphorous etc..
● Good adhesion to thesurface.
Application Area
Mobile phone, Computer ,instrumentation,VCR, communication equipment etc..- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 130 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 350 | |
| CTE（Z-axis） | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
|
After Tg |
ppm/℃ | 235 | |||
| 50-260℃ |
% |
3 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- |
>100S |
|
|
Flexural strength |
IPC-TM-650 2.4.4 |
A |
Mpa |
580/LW | |
| A |
Mpa |
450/CW | |||
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
|
Remarks:
1.Performance data based on the sample S1125 0.30mm testresults.
2.The test method of PS：superposition the ED copper foil(1Oz),bonding film,S1125, then laminate them ,using the pararmeters 170℃、200PSI,40 minutes.Using 90 degree angle peelling.
3.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.