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EN/CN

Product

SP168GN

Characteristic



  • Excellentmechanical processability, punching process applicable.
  • Minimal resin flow, flexible andnearly powderless contamination.
  • Hi-Tgand halogen free.



Application Area

Suitablefor bonding use in heat sink board, die cavity board andmultilayer rigid-flex PCB applications.

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 165
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE(Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 70
After Tg
ppm/℃ 300
T288 IPC-TM-650 2.4.24.1 TMA min >30
Thermal Stress IPC-TM-650 2.4.24.13 288℃, solder dip --

>600S

Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 3.85
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.013
Peel Strength IPC-TM-650 2.4.8 Copper (1/2 oz) N/mm 1.2
Copper (1 oz) N/mm 1.5
CVL N/mm 1.0
Water Absorption IPC-TM-650 2.6.2.1 E-1/105_d-2/23 % 0.14
Flammability UL94 E-24/125
Rating V-0

Remarks:

1.Specimenthickness: 0.8mm. All the typical value listed above is for your referenceonly,  please turn to Shengyi TechnologyCo., Ltd. for detailed information.

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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