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EN/CN

Product

SF325B

Characteristic


●  High bondingstrength

●  Halogen free,Flammability UL94 VTM-0.

●  Excellent solderingreliability, chemical resistance and electrical properties.

●  Excellent anti-ionMigration, no dendrite.

●  Low adhesiveflowing, good processability, suitable for both fast and traditional laminationstyle.

●  Compatible with EU RoHS directive, free of Pb,Hg,Cd,Cr6+,PBB,PBDE, etc..


Application Area

Multi-layer FPC and rigid-flex PCB, etc..
  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Peel Strength(90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.4
288℃、5s 1.3
Solder Resistance IPC-TM-650 2.4.13.F 288℃、10s -

No delamination

Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % 96.2
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 8.0×107
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
8.5×106
Dielectric Constant(10GHz) SPDR C-24/23/50 - 3.4
Dissipation Factor(10GHz) SPDR C-24/23/50 - 0.017
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability
UL94
E-24/125
Rating
VTM-0

Remarks:

*Testing after laminating with shining side of copper foil and PI film insuitable condition.

1.Certified to IPC-4203/20 Unsupportedpolyester adhesive

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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