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EN/CN

Product

SF315C

Characteristic

●  Low transparence, excellentlight-blocking.

●  High bonding strength, gooddimensional stability,

●  Flammability UL94 V-0.

●  Excellent solderingreliability, chemical resistanceand electrical properties.

●  Low adhesive flowing, good processability,suitablefor both fast and traditionallamination style.

●  Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..


Application Area

Coverlay for FPC.
  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Peel Strength(90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.71
288℃、5s 0.7
Solder Resistance IPC-TM-650 2.4.13.F 288℃、10s -

No delamination

Dimensional Stability SY Method After peeling off the paper
% -0.0304/-0.0151
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.1×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.2×105
Dielectric Constant(10GHz) SPDR C-24/23/50 - 3.5
Dissipation Factor(10GMHz) SPDR C-24/23/50
- 0.017
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125
Rating V-0

Remarks:

*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/2 Epoxy adhesive on one or two sides of poyimidedielectric

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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