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SF230
Characteristic
● low dissipation loss approach to LCP
● Excellent soldering reliability,dimensionalstability,chemical resistance andelectrical properties.
● Halogen-free, flammabilityUL94 VTM-0.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Be used in high frequency multi-layer FPCand rigid-flex PCB as the bonding lay- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.36 |
| 288℃、5s | 1.47 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - |
No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4B |
After Etched |
% | 0.0149/-0.0360 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞95 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 200 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
1.2×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
4.5×106 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 3.2 |
| Dissipation Factor(10GHz) | SPDR |
C-24/23/50 |
- | 0.005 |
| Folding Endurance | JIS C-6471 |
R0.8×4.9N |
Times | ＞200 |
| Flammability | UL94 | E-24/125 | Rating |
VTM-0 |
Remarks:
1.Certified to IPC-4204/11 Copper Clad Adhesiveless
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.