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SG7350D2
Characteristic
● Glass-reinforced PTFE and ceramic dielectric.
● Excellent high frequency performance.
● Enhanced thermal conductivity.
● Stable electrical propertiesversus frequency.
● Low Z-axis expansion andexcellent dimensional stability.
●Compatible with lead-free process
Application Area
Passive Components
Power Amplifiers.
Microwave Combiner and Power Dividers
LNA/LNB
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Process Dk | IPC-TM-650 2.5.5.5 [1] | 10GHz/23℃ | - | 3.55 |
| Process Df | IPC-TM-650 2.5.5.5 [1] | 10GHz/23℃ | - | 0.0020 |
| TcDk | IPC-TM-650 2.5.5.5 | -25°C to 125°C | ppm/°C | -15 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ·cm | 5.1 x 107 |
|
Surface Resistivity |
IPC-TM-650 2.5.17.1 |
A | MΩ | 2.5 x 107 |
|
Electrical Strength |
IPC-TM-650 2.5.6.2 |
A |
KV/mm |
|
|
Dielectric Breakdown |
IPC TM-650 2.5.6 |
A |
kV |
|
| Td | ASTM D3850 | TGA (5% W.L) | ℃ | 560 |
| CTE (X/Y/Z-axis) | IPC-TM-650 2.4.24 | TMA (30-260℃) | ppm/℃ | 11/10/26 |
|
Peel Strength |
IPC-TM-650 2.4.8 |
after solder float |
N/mm [ln/in] | 0.95 [5.43] |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/34 | % | 0.05 |
| Thermal Conductivity | ASTM D5470 | 100℃ | W/m·K | 1.23 |
| Flexural Strength (X/Y-axis) | IPC-TM-650 2.4.4 | A | MPa | 90/78 |
|
Flammability |
UL-94 | C-48/23/50 | Rating | V-0 |
Remarks:
(1) Allthe typical value is based on the 0.508mm(0.020”) specimen, and thespecification sheet is based on IPC4103.
(2) Typicalvalues are a representation of an average valuefor the population of the property.